Pixel 11 Leak Reveals Tensor G6, New Cameras, Pixel Glow
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- Tensor G6 will use a 1+4+2 CPU configuration with ARM C1 cores, a PowerVR C-Series GPU, a Titan M3 security chip, a new TPU, and a new GXP image signal processor — notably dropping Samsung's Exynos modem in favor of MediaTek's M90.
- New camera sensors are reportedly coming to the lineup: a 50MP 'chemosh' sensor for the base Pixel 11 and Pro Fold, and 'bastet' and 'barghest' sensors for the main and telephoto cameras on the Pixel 11 Pro and Pro XL.
- 'Pixel Glow' will appear as LEDs on the camera bar of Pro models — similar in concept to Nothing's Glyph interface — and the existing temperature sensor is being removed from the Pro variants.
- RAM configurations are shrinking across the lineup, with the base Pixel 11 reportedly offering 8GB/12GB options and Pro models 12GB/16GB, reversing the 16GB standard Google established starting with the Pixel 9 Pro.
- Project Toscana, Google's upgraded face unlock hardware, will not debut in the Pixel 11 series, per the leak.
- Google's Pixel 11 series is expected to launch in August 2026 with an overall design similar to the Pixel 10 generation.
Why it matters: The RAM downgrade across the lineup directly points to the industry-wide RAM shortage as a cost pressure on Google's flagship pricing strategy, potentially forcing a quiet price hike or downgraded base configurations. The shift from Samsung Exynos to MediaTek modems also loosens Google's long-standing dependency on Samsung silicon, a notable supply chain realignment for a product launching in August.
